Enabling Robust Copper Fill of High Aspect Ratio Through Silicon Vias

Mark Willey; Damo Srinivas; Sesha Varadarajan; David Porter; Easwar Srinivasan; Dennis Hausmann; Jon Henri; Hu Kang; Mayur Trivedi; Tom Mountsier

doi:10.4071/isom-2010-TP1-Paper3

Loading [Contrib]/a11y/accessibility-menu.js

Willey, Mark, Damo Srinivas, Sesha Varadarajan, David Porter, Easwar Srinivasan, Dennis Hausmann, Jon Henri, Hu Kang, Mayur Trivedi, and Tom Mountsier. 2010. “Enabling Robust Copper Fill of High Aspect Ratio Through Silicon Vias.” IMAPSource Proceedings 2010 (1): 176–79. https://doi.org/10.4071/isom-2010-TP1-Paper3.

View more stats