Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Investigation of a proactive glass filler removal in IC substrate build up films and its effect on topography and copper adhesion reliability
Investigation of a proactive glass filler removal in IC substrate build up films and its effect on topography and copper adhesion reliability
Kempa, Stefan, Wolfgang Friz, Florian Gaul, Ellen Habig, and Laurence J. Gregoriades. 2018. “Investigation of a Proactive Glass Filler Removal in IC Substrate Build up Films and Its Effect on Topography and Copper Adhesion Reliability.” IMAPSource Proceedings 2018 (1): 634–39. https://doi.org/10.4071/2380-4505-2018.1.000634.