New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages

Yohei Tateishi; Makoto Fujimura; Takashi Iga; Toshihiko Jimbo

doi:10.4071/isom-2012-WP64

Tateishi, Yohei, Makoto Fujimura, Takashi Iga, and Toshihiko Jimbo. 2012. “New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages.” IMAPSource Proceedings 2012 (1): 991–97. https://doi.org/10.4071/isom-2012-WP64.

View more stats

New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages

This website uses cookies