Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:40836/feed
Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip Reliability

Shirley Asoy, Scott Exon, Liping Zhu, Peter Moon, Michael Carroll, Shannon Pan,
Cu pillar flip-chipreliabilitybump pad designmodeling
https://doi.org/10.4071/isom-2016-TP51
IMAPSource Conference Papers
Asoy, Shirley, Scott Exon, Liping Zhu, Peter Moon, Michael Carroll, and Shannon Pan. 2016. “Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip Reliability.” IMAPSource Proceedings 2016 (1): 100–105. https:/​/​doi.org/​10.4071/​isom-2016-TP51.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system