Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip Reliability
Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip Reliability
Asoy, Shirley, Scott Exon, Liping Zhu, Peter Moon, Michael Carroll, and Shannon Pan. 2016. “Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip Reliability.” IMAPSource Proceedings 2016 (1): 100–105. https://doi.org/10.4071/isom-2016-TP51.
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