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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Improving Stitch Bond on Hybrid Thick Film Substrate using Stand-Off Stitch Wire Bond Technique
Richard C. Garcia
,
Stand-Off Stitch wire bond
Security bond
Ball Bumping
MIL-STD-883 Method 2011.7 bond strength (Destructive Bond Pull Test)
MIL-STD-883
MIL-STD-883 Method 5008 = MIL-PRF-38534F App. C
•
https://doi.org/10.4071/isom-2015-WP36
IMAPSource Conference Papers
Garcia, Richard C. 2015. “Improving Stitch Bond on Hybrid Thick Film Substrate Using Stand-Off Stitch Wire Bond Technique.”
IMAPSource Proceedings
2015 (1): 425–29.
https://doi.org/10.4071/isom-2015-WP36
.
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