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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITY
Carol Gowans
,
Seth Homer
,
Ronald Lasky
,
Solder preforms
pin-in-paste
solder fortification
solder starvation
mobile phone shields
QFN packages
flux
•
https://doi.org/10.4071/isom-2011-TP2-Paper5
IMAPSource Conference Papers
Gowans, Carol, Seth Homer, and Ronald Lasky. 2011. “APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITY.”
IMAPSource Proceedings
2011 (1): 258–63.
https://doi.org/10.4071/isom-2011-TP2-Paper5
.
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