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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Thermally and Electrically Enhanced Wirebond BGA
Burton Carpenter
,
Boon Yew Low
,
Leo M. Higgins
,
Sriram Neelakantan
,
Robert Wenzel
,
Daniel Boyne
,
BGA
Electrical
Film-Assisted Molding
Thermal
Wirebond
ā¢
https://doi.org/10.4071/isom-2013-WA24
IMAPSource Conference Papers
Carpenter, Burton, Boon Yew Low, Leo M. Higgins, Sriram Neelakantan, Robert Wenzel, and Daniel Boyne. 2013. āThermally and Electrically Enhanced Wirebond BGA.ā
IMAPSource Proceedings
2013 (1): 478ā83.
https://doi.org/10.4071/isom-2013-WA24
.
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