Carpenter, Burton, Boon Yew Low, Leo M. Higgins, Sriram Neelakantan, Robert Wenzel, and Daniel Boyne. 2013. “Thermally and Electrically Enhanced Wirebond BGA.” IMAPSource Proceedings 2013 (1): 478–83. https://doi.org/10.4071/isom-2013-WA24.