Improvement of High Power Cycling Reliability having Sn-Cu Based Solder

Miyazaki Takaaki; Ikeda Osamu

doi:10.4071/isom-2015-WP42

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Takaaki, Miyazaki, and Ikeda Osamu. 2015. “Improvement of High Power Cycling Reliability Having Sn-Cu Based Solder.” IMAPSource Proceedings 2015 (1): 443–48. https://doi.org/10.4071/isom-2015-WP42.

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