Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Understanding Mold Compound Behavior on Flip Chip QFN Packages
Understanding Mold Compound Behavior on Flip Chip QFN Packages
Camenforte, Ruby Ann M., Jason Colte, Richard Sumalinog, Sylvester Sanchez, and Jaimal Williamson. 2018. “Understanding Mold Compound Behavior on Flip Chip QFN Packages.” IMAPSource Proceedings 2018 (1): 125–28. https://doi.org/10.4071/2380-4505-2018.1.000125.