ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY

G. Parès; F. De Crecy; S. Moreau; C. Maurice; A Borbely; J. Mazuir; L.L. Chapelon; N. Sillon

doi:10.4071/isom-2011-TP6-Paper1

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Parès, G., F. De Crecy, S. Moreau, C. Maurice, A Borbely, J. Mazuir, L.L. Chapelon, and N. Sillon. 2011. “ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY.” IMAPSource Proceedings 2011 (1): 388–99. https://doi.org/10.4071/isom-2011-TP6-Paper1.

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