Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Through-Silicon-Via (TSV) for silicon package: ″via-bridge″ approach
Through-Silicon-Via (TSV) for silicon package: ″via-bridge″ approach
Lamy, Y., S. Joblot, C. Ferrandon, J.F. Carpentier, and G. Simon. 2012. “Through-Silicon-Via (TSV) for Silicon Package: ″via-Bridge″ Approach.” IMAPSource Proceedings 2012 (1): 233–38. https://doi.org/10.4071/isom-2012-TP11.