Wafer Level 3D System Integration using a Novel 3D-RDL Technology

Ayad Ghannam; Alessandro Magnani; David Bourrier; Thierry Parra

doi:10.4071/isom-2015-TP36

Ghannam, Ayad, Alessandro Magnani, David Bourrier, and Thierry Parra. 2015. “Wafer Level 3D System Integration Using a Novel 3D-RDL Technology.” IMAPSource Proceedings 2015 (1): 92–97. https://doi.org/10.4071/isom-2015-TP36.

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