Vol. 2019, Issue 1, 2019October 01, 2019 EDT
High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
Zhao, Yuan, Doug Katze, John Wood, Bruno Tolla, and Howard Yun. 2019. “High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications.” IMAPSource Proceedings 2019 (1): 360–63. https://doi.org/10.4071/2380-4505-2019.1.000360.