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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Multi-layer PC boards Fabricated using Aerosol-jet Printing
John Bolger
,
Leon Lantz
,
Rich Lewis
,
Rick Trudeau
,
Daniel Hines
,
Printed Electronics
Additive Manufacturing
Multi-layer Board
•
https://doi.org/10.4071/isom-2013-THP54
IMAPSource Conference Papers
Bolger, John, Leon Lantz, Rich Lewis, Rick Trudeau, and Daniel Hines. 2013. “Multi-Layer PC Boards Fabricated Using Aerosol-Jet Printing.”
IMAPSource Proceedings
2013 (1): 921–26.
https://doi.org/10.4071/isom-2013-THP54
.
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