Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump Design
Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump Design
Sethu, Raj Sekar, Salil Hari Kulkarni, How Ung Ha, and Kok Heng Soon. 2017. “Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump Design.” IMAPSource Proceedings 2017 (1): 502–7. https://doi.org/10.4071/isom-2017-THA14_014.