Multi-axis Process integration for Wafer Scale and Substrate-Like Printed Electronics

C. Mike Newton; Rudy Ghosh; Grant Wachtel; Connor Whitley

doi:10.4071/001c.128408

Newton, C. Mike, Rudy Ghosh, Grant Wachtel, and Connor Whitley. 2025. “Multi-Axis Process Integration for Wafer Scale and Substrate-Like Printed Electronics.” IMAPSource Proceedings 2024 (DPC): 445–81. https://doi.org/10.4071/001c.128408.

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Multi-axis Process integration for Wafer Scale and Substrate-Like Printed Electronics

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