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https://imapsource.org/article/67062-preliminary-model-and-technology-of-piezoelectric-low-temperature-co-fired-ceramic-ltcc-uniaxial-accelerometer 2023-05-02 https://imapsource.org/article/67053-combined-3d-micro-structuring-of-ceramic-green-tape-using-punching-embossing-and-laser-processing 2023-05-02 https://imapsource.org/article/55827-microfabrication-and-packaging-process-for-a-single-chip-position-navigation-and-timing-system 2023-05-02 https://imapsource.org/article/67066-tunable-ferroelectric-ceramic-components-for-reconfigurable-wireless-communications 2023-05-02 https://imapsource.org/article/67070-effective-compensation-of-the-temperature-coefficient-of-resonant-frequency-in-ltcc 2023-05-02 https://imapsource.org/article/67073-infrared-optical-and-mechanical-properties-of-ceramic-coatings-fabricated-by-aerosol-deposition 2023-05-02 https://imapsource.org/article/67379-patterned-permanent-bonding-of-benzocyclobutene-based-dielectric-materials-for-advanced-wafer-level-packaging 2023-05-02 https://imapsource.org/article/67328-packaging-trends-and-challenges-for-power-devices 2023-05-02 https://imapsource.org/article/67076-characterization-of-the-fabrication-process-of-rolled-ltcc-structures 2023-05-02 https://imapsource.org/article/67072-determination-of-the-stability-of-low-viscous-particle-inks 2023-05-02 https://imapsource.org/article/67666-design-of-tsv-based-inductors-for-internet-of-things 2023-05-02 https://imapsource.org/article/67074-properties-of-glass-less-photoimageable-paste-for-multilayer-ltcc-structures-fabrication 2023-05-02 https://imapsource.org/article/67078-silver-processing-in-thick-film-technology-for-power-electronics 2023-05-02 https://imapsource.org/article/67092-low-firing-functional-materials-for-application-in-power-electronics 2023-05-02 https://imapsource.org/article/67112-yearlong-500-c-operational-demonstration-of-up-scaled-4h-sic-jfet-integrated-circuits 2023-05-02 https://imapsource.org/article/67084-lamination-of-ltcc-at-low-pressure-and-moderate-temperature-using-screen-printed-adhesives 2023-05-02 https://imapsource.org/article/67134-lt-tlps-die-attach-for-high-temperature-electronic-packaging 2023-05-02 https://imapsource.org/article/67087-room-temperature-fabrication-for-functional-oxide-nanofilms-using-oxide-nanosheets 2023-05-02 https://imapsource.org/article/67096-influence-of-initial-shear-strength-on-time-to-failure-of-copper-cu-wire-bonds-in-thermal-aging-condition 2023-05-02 https://imapsource.org/article/67098-highly-reliable-pressure-less-silver-sintering-joints 2023-05-02 https://imapsource.org/article/67354-cost-comparison-of-temporary-bond-and-debond-methods-for-thin-wafer-handling 2023-05-02 https://imapsource.org/article/67107-new-capacitance-sensor-performance 2023-05-02 https://imapsource.org/article/67109-sixty-earth-days-test-of-a-prototype-pt-htcc-alumina-package-in-simulated-venus-environment 2023-05-02 https://imapsource.org/article/67104-from-chips-to-modules-tackling-the-high-temperature-design-challenge 2023-05-02 https://imapsource.org/article/67106-digital-logic-synthesis-for-470-celsius-silicon-carbide-electronics 2023-05-02 https://imapsource.org/article/67116-analog-and-logic-high-temperature-integrated-circuits-based-on-enhancement-mode-planar-sic-jfets 2023-05-02 https://imapsource.org/article/67102-identification-of-thermo-mechanical-fatigue-fracture-location-by-transient-thermal-analysis-for-high-temperature-operating-sic-power-module-assembled 2023-05-02 https://imapsource.org/article/67307-microbump-processing-for-3d-ic-integration 2023-05-02 https://imapsource.org/article/67111-robust-reliability-of-ceramic-capacitors-for-power-electronics 2023-05-02 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https://imapsource.org/article/67141-enhanced-high-temperature-performance-of-pd-soi-mosfets-in-analog-circuits-using-reverse-body-biasing 2023-05-02 https://imapsource.org/article/67311-investigation-of-a-proactive-glass-filler-removal-in-ic-substrate-build-up-films-and-its-effect-on-topography-and-copper-adhesion-reliability 2023-05-02 https://imapsource.org/article/67349-the-impact-of-ausn-preforms-thickness-on-solder-joint-reliability 2023-05-02 https://imapsource.org/article/67151-silicon-capacitors-with-extremely-high-stability-and-reliability-ideal-for-high-temperature-applications 2023-05-02 https://imapsource.org/article/67175-sealing-dispensing-requirements-to-meet-mems-packaging-and-throughput-impact 2023-05-02 https://imapsource.org/article/67156-dip-test-socket-characterization-for-300-c 2023-05-02 https://imapsource.org/article/67391-fatigue-testing-of-bulk-materials-using-a-microsystems-based-approach 2023-05-02 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https://imapsource.org/article/67161-integration-of-passive-components-into-3d-pop-fan-out-packages 2023-05-02 https://imapsource.org/article/67217-a-new-embedded-package-structure-and-technology-for-the-next-generation-of-wlp-the-wafer-level-fun-out-package-wfop-tm 2023-05-02 https://imapsource.org/article/67196-strain-in-electroless-copper-films-analysis-by-in-situ-x-ray-diffraction-and-curvature-methods 2023-05-02 https://imapsource.org/article/67206-novel-low-loss-photodefined-electrical-tsvs-for-silicon-interposers 2023-05-02 https://imapsource.org/article/67181-semiconductor-fluxes-for-wafer-bumping-in-3d-assembly 2023-05-02 https://imapsource.org/article/67321-enepig-reliability-enhancement-by-simple-drop-in-process-changes 2023-05-02 https://imapsource.org/article/67215-reliability-and-performance-improvements-of-3d-system-in-packages-in-fan-out-wafer-level-packaging 2023-05-02 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https://imapsource.org/article/67216-thermal-mechanical-challenges-for-3dic-integration 2023-05-02 https://imapsource.org/article/67318-the-bifurcation-of-advanced-packaging 2023-05-02 https://imapsource.org/article/67186-polymer-based-interposer-offering-si-matched-cte-esd-protection 2023-05-02 https://imapsource.org/article/67207-ultra-fine-pitch-package-on-package-solution-for-high-bandwidth-mobile-applications 2023-05-02 https://imapsource.org/article/67194-advanced-passive-thermal-management-for-led-bulb-systems 2023-05-02 https://imapsource.org/article/67190-copper-nickel-and-lead-free-solder-electroplating-solutions-for-pillar-and-micro-pillar-capping-applications 2023-05-02 https://imapsource.org/article/67209-assembly-standardization-for-the-diverse-packaging-requirements-of-mems-sensors 2023-05-02 https://imapsource.org/article/74594-simple-solution-to-estimating-and-predicting-transient-current-in-small-signal-ac-circuits 2023-05-02 https://imapsource.org/article/67218-through-si-vias-using-liquid-metal-conductors-for-re-workable-3d-electronics 2023-05-02 https://imapsource.org/article/67327-novel-formaldehyde-free-electroless-copper-for-plating-on-next-generation-substrates 2023-05-02 https://imapsource.org/article/67248-thick-film-pastes-for-silicon-nitride-ceramics 2023-05-02 https://imapsource.org/article/67213-electrical-characterization-on-a-high-speed-wafer-level-package 2023-05-02 https://imapsource.org/article/67225-modeling-the-failure-mechanism-of-electrical-vias-manufactured-in-thick-film-technology 2023-05-02 https://imapsource.org/article/55911-stacking-aspects-in-the-view-of-scaling 2023-05-02 https://imapsource.org/article/67241-electroplating-and-electroless-plating-process-development-for-dupont-greentape-9k7-ltcc 2023-05-02 https://imapsource.org/article/67223-assembly-challenges-for-2-5d-packages 2023-05-02 https://imapsource.org/article/67243-frequency-and-time-domain-performance-of-ltcc-transmission-lines-fabricated-using-multiple-printing-techniques 2023-05-02 https://imapsource.org/article/67603-high-temperature-cmos-reliability-and-drift 2023-05-02 https://imapsource.org/article/67228-thick-film-pastes-for-power-applications 2023-05-02 https://imapsource.org/article/67247-feasibility-of-screen-printed-pzt-microceramics-for-structural-health-monitoring-piezocomposites-applications 2023-05-02 https://imapsource.org/article/67256-realization-of-high-q-fano-resonances-in-ceramic-dielectric-metamaterials-for-sensing-applications 2023-05-02 https://imapsource.org/article/67425-uv-c-leds-for-sterilization-applications 2023-05-02 https://imapsource.org/article/56305-quality-and-reliability-of-3d-tsv-interposer-and-fine-pitch-solder-micro-bumps-for-28nm-technology 2023-05-02 https://imapsource.org/article/67229-a-process-dependent-warpage-and-stress-model-for-3d-packages-considering-incoming-die-substrate-warpage-and-assembly-process-impacts 2023-05-02 https://imapsource.org/article/67641-system-level-ic-packaging-integration-of-key-technologies-tsvs-interposers-and-advanced-ic-packaging 2023-05-02 https://imapsource.org/article/67231-improved-trans-endothelial-electrical-resistance-sensing-using-microfluidic-low-temperature-co-fired-ceramics 2023-05-02 https://imapsource.org/article/67238-piezoelectric-and-dielectric-enhancement-of-new-nano-structured-ceramics-with-heteroepitaxial-interfaces 2023-05-02 https://imapsource.org/article/67491-advances-in-3d-memory-and-logic-devices 2023-05-02 https://imapsource.org/article/66788-the-increasing-challenges-in-testing-mems 2023-05-02 https://imapsource.org/article/67224-detection-and-mitigation-of-electrostatic-pull-in-instability-in-mems-parallel-plate-actuators 2023-05-02 https://imapsource.org/article/67234-electric-micro-propulsion-in-low-temperature-co-fired-ceramics 2023-05-02 https://imapsource.org/article/67598-development-of-a-sic-sspc-module-with-advanced-high-temperature-packaging 2023-05-02 https://imapsource.org/article/67232-feasibility-of-micro-plasma-transistor-devices-in-ltcc 2023-05-02 https://imapsource.org/article/67245-inkjet-printing-of-piezoelectric-lead-magnesium-niobate-lead-titanate-thick-films 2023-05-02 https://imapsource.org/article/67278-a-novel-low-cost-roll-to-roll-manufacturing-compatible-ultra-thin-chip-integration-and-direct-metal-interconnection-process-for-flexible-hybrid-electr 2023-05-02 https://imapsource.org/article/67713-developments-for-copper-graphite-composite-thermal-cores-for-pcbs-for-high-reliability-and-high-temperature-rf-systems 2023-05-02 https://imapsource.org/article/67236-aerosol-jet-printing-of-two-component-thick-film-resistors-on-ltcc 2023-05-02 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